Types of substrate support mats
Comparison of types and characteristics of substrate support mats The most common types of substrate support mats at this stage are HTCC, LTCC, DBC, and DPC. Among them, HTCC is a technology developed earlier, but the selection of electrode materials is limited due to the high sintering temperature. These factors promote the development of LTCC. Although LTCC reduces the co-firing temperature to about 850 °C, the disadvantage is that the dimensional accuracy and product strength are not easy to control. While DBC and DPC are domestically developed and mature technologies for energy production in recent years, DBC uses high-temperature heating to combine Al2O3 and Cu plates. The technical bottleneck is that it is difficult to solve the problem of micro-porosity between Al2O3 and Cu plates. However, the DPC technology uses direct copper plating technology to deposit Cu on the Al2O3 substrate. The process combines materials and thin-film process technology. Its product is the most commonly used substrate support mat in recent years. The above are the types of substrate support mats.
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